Defect Detection: X-ray inspection can reveal hidden defects like solder bridges, solder voids, and internal cracks in PCBs and components.
Component Verification: It can confirm the correct placement and orientation of components, ensuring that they are assembled according to design specifications.
Soldering Quality Control: X-rays can identify issues like incomplete solder joints, air pockets, and foreign particles in solder joints.
Internal Structure Analysis: X-ray imaging allows for detailed examination of internal structures within electronic components, such as integrated circuits (ICs) or transistors.
Process Optimization: X-ray inspection helps optimize manufacturing processes by revealing defects early in the production cycle, reducing rework and waste.
R&D Support: X-ray imaging is valuable in R&D, enabling the analysis of new technologies and the identification of potential issues before mass production.
Ensuring Compliance: X-ray inspection can help ensure that electronic products meet industry standards and quality requirements.