If the solder paste printed on the pad is too thick the chip components will float on the molten solder. This floating of the component will cause an unbalanced pulling force and results in tomb stoning. Various factors can affect the printing thickness such as stencil pressure, squeegee pressure, solder powder underneath the stencil, etc. House-plate or U- shaped aperture designs are used to solve solder beading problems by reducing the amount of solder paste printed on the pad. These aperture designs also help to eliminate tomb stoning problems, which are caused by component floating (Fig. 5).