SP Series Solder Paste

This LED PCB solder paste is specially engineered for light LED applications, ensuring excellent wetting even with leadless devices. It minimizes voiding under LEDs and boasts an 8-12 hour tack time. Vapor phase compatible, it provides good fluidity and soldering effects with favorable wetting on various substrate materials. It also offers a wide furnace temperature range and excellent welding performance in both “heating then preservation” and “gradually heating” furnace settings. A specialized version is available for BGA chip carriers, addressing BGA welding challenges & Paste offers good ICT test performance.

ZERO Halogen
Mainly use with Surface Mount Technology
Availability with T3 & T4 Solder Powder
Currently Used with Sn63/Pb37 & Sn55/Pb45 Alloy
No visible residue remain on the PCB
Excellent printing performance
Suitable with Electronics Applications
Better Shine & Smooth Surface on Solder Joint

LED Assembly – Specifically designed for light LED applications with excellent wetting properties on leadless devices
BGA Chip Assembly – Specialized version available for BGA chip carriers to address welding challenges
Multi-Substrate Applications – Provides favorable wetting on various substrate materials
Vapor Phase Soldering – Compatible with vapor phase soldering processes
Flexible Furnace Operations – Suitable for both “heating then preservation” and “gradually heating” furnace settings
ICT Testing Applications – Offers good In-Circuit Test (ICT) performance for quality control
Low Voiding Requirements – Ideal for applications where minimal voiding under components is critical
Extended Tack Time Applications – 8-12 hour tack time suitable for complex assembly processes

Alloys	Melting Temperatures (℃)	Peak Reflow Temperature Range (℃)	Alloy Attributes
SN63/PB37	183°C	220°C~240°C	Low Voiding: <5% on BGA and <10% on BTC Excellent Print Transfer Efficiencies <0.50 AR Eliminates HiP Defects Minimal Transparent Residue – LED Compliant Passes Bono and Automotive SIR Testing"
7722 PASTE	180°C~185°C	205°C~230°C	Specially Engineered for Rope / Strip Light LED FPCB Excellent Wetting, Even Leadless Devices Reduces Voiding Under LED’s 8-12 Hour Tack Time Vapor Phase Compatible
8190 PASTE	183°C ~ 203°C	210℃~245℃	Specially Engineered for Light LED PCB. Excellent Wetting, Even Leadless Devices Reduces Voiding Under LED’s 8-12 Hour Tack Time Vapor Phase Compatible
6209-04 PASTE	179°C -189°C	235°C~260°C	Good fluidity and good soldering effect Favorable wetting property A wide furnace temperature range for reflow soldering Excellent welding performance during “heating then preservation” and “gradually heating” furnace settings Good ICT test performance
6209 PASTE	179°C	235°C~260°C	A mid-temperature leaded solder paste, is used in the manufacturing of PCBs and SMT applications, especially for connecting surface components to pads on the board, providing both electrical and thermal connections.

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For TDS (Technical Data Sheet) & SDS (Safety Data Sheet) send email on support@pai-aimsolder.com