Sn63/Pb37 | Persang-alloy

Sn63/Pb37 Leaded Solder Alloy

Sn63/Pb37 Electropure™ is a high purity alloy that is composed of 63% tin and 37% lead. PAI-AIM’s Electropure proprietary method reduces oxides in the solder resulting in a low drossing, strong wetting alloy with improved flow.

Sn63/Pb37 has a melting point of 183°C (361°F) which can be used in SMT, wave, selective and hand soldering processes. Its resistance to thermal fatigue makes it preferred for military and aerospace applications.

Sn63/Pb37 is available in solder paste, solder bar, solid and cored solder wire.

High Purity
Manufactured with PAI-AIM Electropure™ Process
Reduces Dross
High Reliability
Excellent Thermal Cycling Performance
Exceeds IPC-J-STD-006 Specifications

Excellent resistance to thermal fatigue
Preferred for aerospace and military applications
Eutectic alloy: bright, shiny solder joints
Melting temperature: 183°C
Leaded solder paste available in T4

Composition	Melting Temperatures (℃)	Peak Reflow Temperature (℃)	Cost Level
Sn/Pb	183°C	205°C – 215°C	$

If the document you need is not listed below, please contact your local PAI-AIM Customer Service Rep or contact us to request the document.

Sn63/Pb37 TDS – English
For SDS (Safety Data Sheets) send email on support@pai-aimsolder.com