Sn42-Bi58 Low Temperature Solder Alloy

Sn42/Bi58 is a low melting temperature alloy composed of 42% tin, 58% bismuth. Low temperature solders require a lower peak reflow temperature than other lead-free solder alloys reducing energy consumption and component-warpage related defects such as NWO (non-wet opens).

Sn42/Bi58 alloy is available with specially formulated fluxes to ensure solder joint integrity and high electrochemical performance, even at reduced reflow temperatures.

Manufactured with AIM Electropure™ Technology
Good Fatigue Characteristics
Improved Wetting
Low Temp Alloy: Melting Point:138°C
RoHS Compliant
Complies with IPC J-STD-006

Lead-free low melt alloy
Low temperature solder paste reduces overall reflow profile temperature significantly lower than SAC305 (217-219℃)
Reduces NOW/HiP defects on temperature sensitive components
Good wetting performance required for quick, post-assembly attachments

Composition	Melting Temperatures (℃)	Peak Reflow Temperature (℃)	Cost Level
Sn/Bi/Ag	138°C	235°C	$$

If the document you need is not listed below, please contact your local PAI-AIM Customer Service Rep or contact us to request the document.

- For TDS (Technical Data Sheet) & SDS (Safety Data Sheet) send email on support@pai-aimsolder.com