REL22™ | Persang-alloy

REL22™ Lead-Free Solder Alloy

PAI-AIM’s REL22™ Lead-Free Solder Alloy is engineered to provide high reliability soldering in harsh service environments. REL22’s enhanced mechanical properties and thermal cycling properties are proven to increase reliability of QFN and leadless components versus SAC Alloys.

REL22 has been subjected to reliability testing required for use in automotive, aerospace and high-power LED applications. Testing shows REL22 reduces tin whisker formation and when used in through-hole soldering, REL22 produces the least solder dross compared to competing and SAC alloys in selective and wave soldering processes.

REL22 High Reliability Solder Alloy was awarded Circuits Assembly’s New Product Introduction (NPI) Award at IPC APEX.

REL22 is available in solder paste, cored solder wire, and solder bar.

High Reliability
Enhanced Thermal Cycling Performance and Mechanical Durability vs. All SAC Alloys
Wide Assembly Process Window vs. Competitive High Reliability Alloys
Mitigates Tin Whisker Formation
Improved Wetting Versus All Low/No-Silver Alloys
For use in Lead-Free Process Only

Reduces BGA warpage, which minimizes HiP and NWO (Non-Wet Open) defects
Lowers process temperatures for thin or temperature sensitive components
Used in step soldering or second-solder reflow applications to exploit the different melting temperatures of two alloys
Reduces carbon footprint and energy costs
Lowers material and component costs

Alloys	Melting Temperatures (℃)	Peak Reflow Temperature Range (℃)	Cost Level
Sn/Cu/Ag/Bi/Ni/Sb/X	210°C -212°C	240°C-250°C	$$$

If the document you need is not listed below, please contact your local PAI-AIM Customer Service Rep or contact us to request the document.

For TDS (Technical Data Sheet) & SDS (Safety Data Sheets) send email on support@pai-aimsolder.com