Solder Flux & Thinner

Optimized & Industry-ready Solutions

PAI-AIM’s wide selection of liquid and paste fluxes are available in no clean, water soluble and RMA formulations engineered to provide exceptional soldering performance to fulfill demanding thru-hole and SMT assembly requirements. PAI-AIM’s flux products offer a broad range of benefits with proven performance in wave, selective, and rework soldering applications. PAI-AIM’s flux products are available for use with tin/lead, lead-free and low temperature solder alloys.

PAI-AIM’s no clean flux is designed to leave minimal, electrochemically safe post-process residues. PAI-AIM’s no clean flux provides fast wetting and increased PTH barrel fill while reducing common soldering defects including bridging and solder balls. PAI-AIM’s no clean flux activation system has a wide process window that can withstand high process temperatures.

PAI-AIM’s water soluble flux products offer a wide process widow with superior wetting characteristics and easy to clean post process residues.

PAI-AIM’s rosin based liquid flux is designed for use in avionic and military type applications with non-corrosive residues that can easily be cleaned using a solvent or saponifier. PAI-AIM’s rosin based flux provides improved soldering performance, excellent thermal transfer and can be foamed, sprayed or dipped.

RMA202-25 Liquid Flux

PAI-AIM’s VOC-free liquid flux products are environmentally friendly, water based fluxes with exceptional performance and reliability characteristics. PAI-AIM’s VOC-free line offers excellent barrel fill and wetting performance with a wide process window.

NC275B Liquid Flux

PAI-AIM’s paste flux is available in no clean, water soluble, and rosin based chemistries. PAI-AIM’s paste flux is for use in rework applications, general touch up, rework of PCBs, BGA rework and ball sphere attachment applications.

NC Paste Flux

Solder Flux & Thinner Selection Guide:

Product	Flux Type	Wave Soldering	Selective Soldering	Rework/Hand Soldering	Product Attributes
FX16	No Clean	✓	✓	X	Halide/halogen-free \| High SIR performance \| Fast wetting and broad process window
NC Paste Flux	No Clean	X	X	✓	Excellent wetting \| Ideal for rework and attaching spheres to BGA packages
NC217 Gel Flux	No Clean	X	X	✓	Ideal for BGA rework \| Wide process window \| Low voiding \| Passes SIR unheated
NC275B	No Clean	✓	X	X	VOC-free, zero halide/halogen \| Broad process window \| High activity
NC280	No Clean	X	✓	✓	Ideal for rework applications \| Halide-free \| High reliability applications \| Passes SIR unheated
RMA202-25	Rosin	✓	X	X	Non-corrosive/non-conductive Cleanable residue \| Military/high reliability applications \| IPC-A-610F class 3 compliant
WS715M	Water Soluble	✓	✓	X	Residues easy to clean with DI water \| pH neutral \| Low foaming in wash \| Excellent wetting
WS716	Water Soluble	✓	✓	X	Halide/halogen-free \| Excellent wetting \| Wide process window \| Easy-to-clean residues