Solder Paste

PAI-AIM offers a range of no-clean solder pastes that deliver excellent performance and reliability while eliminating the need for costly cleaning processes. These pastes are formulated for consistent and efficient transfer, strong wetting, and reduced void formation, making them suitable for both current and emerging assembly technologies. PAI-AIM’s comprehensive line of no-clean solder pastes comes in various alloys to match specific process demands. Post-reflow, they leave non-corrosive residues with no impact on the assembly’s performance. No-clean solder paste is designed for applications where post-soldering cleaning is unnecessary, providing minimal, non-conductive residues.

PAI-AIM’s water soluble solder paste products have been engineered for powerful wetting and exceptional print performance even in high humidity environments. Our water soluble paste residues are easily removed with DI water alone up to 48 hours after reflow, even under low stand-off devices. These formulations are low foaming and can extend closed loop filtration service life. PAI-AIM’s water soluble product offerings exceed industry demands for a reliable, low voiding solder paste.

PAI-AIM’s RMA/RA solder pastes are designed for use where mil spec performance is required. Our rosin based solder pastes provide modern paste print performance combined with traditional military compliance. Additionally, these pastes can withstand extended hot reflow profiles required for backplane and thermally massive assemblies. PAI-AIM’s rosin solder pastes provide superior performance on oxidized or uncleaned surfaces and long pause-to-print capabilities. PAI-AIM has partnered with aqueous, solvent and vapor degreaser cleaning manufacturers to ensure residues can be removed with all systems and leave no white residue.

RMA258-15R Solder Paste

PAI-AIM’s low temperature solder paste offers exceptional performance combined with peak reflow temperatures as low as 170°C. PAI-AIM’s NC273LT solder paste provides 8+ hour stencil life, stable transfer efficiency and excellent wetting, while eliminating solder balling that is common with bismuth bearing pastes.

NC273LT Solder Paste

Solder Paste Selection Guide:

*Additional powder sizes may be available upon request.

Product	Flux Type	Available Powder Sizes	Standard Alloys	Dispensing Capability	Product Attributes
W20	Water Soluble	T4	SAC305	No	Halogen/Halide Free \| Residue easily cleaned in DI Water \| 8+ hour stencil life \| 2+ week extended cleaning window
WS488	Water Soluble	T4	SAC Alloys, Sn/Pb Alloys	✓ Yes	Excellent wetting \| Residue easily cleaned in DI water \| Superior slump resistance \| 8+ hour stencil life
RMA258-15R	Rosin	T4	SAC Alloys, Sn/Pb Alloys	✓ Yes	Long pause-to-print capabilities \| Reduced voiding \| For use during long, hot reflow profiles
NC273LT	No Clean	T4	Sn/Bi Alloys	✓ Yes	Used for low or reduced temperature applications \| Improved wetting for use with bismuth alloys \| 8+ hour stencil life

Solder Powder Size Quick Guide:

PAI-AIM Solder Pastes come in different powder sizes, ranging from Type 3 to Type 7.

Type	Size (µm)	Lower Limit of Stencil Aperture*	Use Cases
Type 3	25-45 µm	225 µm	0402s and larger
Type 4	20-38 µm	190 µm	Industry standard; 0201s, 0.5mm BGAs
Type 5	15-25 µm	125 µm	µBGAs, 01005s
Type 6	5-15 µm	75 µm	MicroLEDs, advanced SiP
Type 7	2-11 µm	55 µm	Micro/nano devices

*Per 5-ball rule

Optimized & Industry-ready Solutions

Solder Paste

Solder Paste Selection Guide:

Solder Powder Size Quick Guide: