Solder Bar

Optimized & Industry-ready Solutions

Solder Bar

PAI-AIM Electropure™ bar solder is processed from high-quality, virgin metals in a proprietary method that removes contaminants and reduces dissolved oxides. PAI-AIM’s Electropure™ technique results in an extremely pure, low-drossing solder bar that increases throughput and decreases defects.

PAI-AIM’s solder alloys are engineered to be compatible with a variety of PCB assembly products including solder paste, solder wire, and flux.

SAC alloys have become the standard alloy choice throughout the electronics assembly industry, most commonly SAC305. PAI-AIM’s SAC alloys provide excellent solder joint reliability, fatigue resistance and copper dissolution rates. PAI-AIM’s SAC alloys comply with IPC, JEDEC, RoHS, and REACH lead-free soldering standards.

PAI-AIM’s low and no silver alloys provide high performance options compared with the SAC type alloys but with a significant cost saving. PAI-AIM’s low and no silver alloy offerings are headlined by next generation REL61TM and the patented SN100C alloy. Both alloys are lower cost options with similar or superior soldering and reliability characteristics compared to SAC alloys. PAI-AIM’s low and no silver alloys comply with IPC, RoHS, and REACH standards.

PAI-AIM’s low temperature soldering materials includes low and reduced temperature reflow requirements. PAI-AIM’s lead-free low temperature alloys provide a melting temperature of 140°C-170°C reducing peak reflow temperatures by as much as 50°C. PAI-AIM low temperature fluxes have been specially formulated to work in combination with Sn/Bi (X) alloys to provide excellent processing characteristics as well as excellent wetting and joint strength.

PAI-AIM’s leaded solder alloys offer a low melting point and increased reliability over lead free solder alternatives. PAI-AIM’s leaded (Pb-bearing) solder alloys continue to be used/specified in medical, military, and aerospace applications.

Solder Alloy Selection Guide:

PAI-AIM offers a broad range of alloys for SMT, wave soldering, hand soldering, and various applications. Commonly used alloys for the electronics industry are shown below. *Other alloys and solder forms are available upon request.

Alloy Melting Point °CProduct Attributes Solder PasteBar Solder Cored Wire Solid Wire
Sn42/Bi58 138 For low temperature soldering applications. Alloys containing high amount of bismuth have unique properties that may require special considerations. ✓✓✓
Sn42/Bi57/Ag1138 For low temperature soldering applications. Alloys containing high amount of bismuth have unique properties that may require special considerations. ✓✓✓
Sn63/Pb37183Not RoHS/REACH compliant. ✓✓✓✓
REL22™210-212High reliability, high strength lead-free solder alloy. Exceptionally durable for extreme service environments. ✓✓✓✓
CASTING® 217-219Improved drop-shock performance versus SAC305. ✓✓✓✓
SAC305217-220Industry standard for SMT and through hole soldering. High purity and high performance alloy.✓✓✓✓
REL61™208-215Enhanced reliability, high strength/low silver, lead-free solder alloy. Exhibits good wetting. Mitigates tin whisker formation. ✓✓✓✓
SAC0307217-227Cost effective alternative to SAC alloys. Primarily used in wave, selective and hand soldering due to higher melting temperatures. High purity and high performance alloy ✓✓✓✓
SN100C227Near eutectic, low/no silver, cost effective alternative for wave soldering and hand soldering applications. ✓✓✓✓
Sn99.3/Cu0.7 227Near eutectic, low/no silver, cost effective alternative for wave soldering and hand soldering applications. ✓✓✓✓