NC273LT Solder Paste

PAI-AIM’s NC273LT Low Temperature Solder Paste features a revolutionary activator system that enhances wetting performance, prolongs stencil life, and achieves excellent transfer efficiencies. Additionally, it effectively minimizes solder balling, a common issue with high bismuth materials.

Low temperature solder materials like NC273LT also decrease peak reflow temperature requirements to as low as 170°C to 175°C (340°F to 350°F). This reduction in temperature leads to cost savings, lower CO2 emissions, and reduced HiP defects.

*lead-free alloys

Designed for low temperature solder applications
Increased wetting attributes
Reduce HiP (Head-in-Pillow) defects
>8-hour long stencil life
Minimize solder balling
Excellent transfer efficiencies
RoHS compliant

Reduces BGA warpage, which minimizes HiP and NWO (Non-Wet Open) defects
Lowers process temperatures for thin or temperature sensitive components
Used in step soldering or second-solder reflow applications to exploit the different melting temperatures of two alloys
Reduces carbon footprint and energy costs
Lowers material and component costs

Alloys	Melting Temperatures (℃)	Peak Reflow Temperature Range (℃)	Alloy Attributes
Sn42/Bi58	138°C	163°C-188°C	High purity Eutectic alloy Low melting temperature
Sn42/Bi57/Ag1	138°C- 140°C	163°C-188°C	High purity Low melting temperature Addition of Ag increases ductility

If the document you need is not listed below, please contact your local PAI-AIM Customer Service Rep or contact us to request the document.

NC273LT TDS – English
For SDS (Safety Data Sheets) send email on support@pai-aimsolder.com