M8 Solder Paste

PAI-AIM engineered M8 No Clean Solder Paste for the most demanding applications, including automotive, LED lighting and EMS assemblies. M8 solder paste provides consistent transfer efficiency at area ratios >0.50 while eliminating head-in-pillow (HiP) and non-wet-open (NWO) defects. It also reduces voiding to <5% on BGA components and <10% on BTC components.

M8’s flux system provides powerful wetting performance even on lead-free surfaces while leaving minimal, clear, pin-testable residue with high SIR properties. Formulated for use with type 4 powder, M8 is also compatible with type 5 and type 6 mesh sizes in both leaded and lead-free alloys.

To guarantee the highest quality, PAI-AIM collaborates closely with coating and cleaning industry leaders, ensuring that M8’s residues can be directly conformally coated or easily removed using standard no clean flux cleaning processes.

*lead-free alloys

Excellent print transfer efficiencies on 01005s and >0.50 area ratios
Formulated for use with T4 and finer powders
Low voiding: <5% on BGAs and <10% on BTC components
Eliminate s HiP (head-in-pillow) defects
Minimal transparent residue – LED compliant
Pin-testable
Powerful wetting on lead-free surfaces
Passes Bono and automotive SIR testing
8+ hour stencil life
Available in leaded and lead-free alloys
REACH and RoHS Compliant*

Provides stable print performance for the most demanding, high density electronic assemblies
Solves issues related to ultra-fine pitch printing, NWO defects, and voiding on a variety of LED, QFN, LGA and µmBGA components
Accommodates a wide range of profiling processes and techniques
Reduces DPMO (Defects Per Million Opportunities)
Residues are clear and pin-testable that pass stringent automotive and military high reliability SIR testing requirements
Available for printing and dispensing solder paste applications

Alloys	Melting Temperatures (℃)	Peak Reflow Temperature Range (℃)	Alloy Attributes
SAC305	217°C -220°C	230°C-260°C	Excellent wetting characteristics Compatible with all flux types
REL61	208°C -215°C	230°C-250°C	Enhanced reliability vs low/no-silver alloys Low-cost alternative to SAC alloys Improved wetting vs low/no-silver alloys
REL22	210°C -219°C	230°C-250°C	Enhanced/ High reliability for use in extremely harsh environments Improved thermal cycling performance Improved wetting vs low/no-silver alloys
SN100C	227°C	240°C-260°C	Low-cost alternative to SAC alloys Silver-Free Bright shiny solder joints
Sn63/Pb37	183°C	205°C-235°C	Legacy alloy for electronics soldering Mil-spec approved Product contains Pb (leaded alloy)

If the document you need is not listed below, please contact your local PAI-AIM Customer Service Rep or contact us to request the document.

M8 TDS – English
For SDS (Safety Data Sheets) send email on support@pai-aimsolder.com