PAI-AIM formulated WS488 Water Soluble Solder Paste to deliver robust wetting capabilities, specifically targeting challenging surfaces, components, and assemblies. WS488 provides a long stencil life, superior slump resistance, and a wide process window, ensuring optimal performance during soldering processes.

After reflow, WS488 post-reflow residues are easily cleaned with DI water, especially under low-standoff devices. This simplifies the cleaning process and helps maintain a high level of reliability in the final assembly.

WS488 is available with T4 powder, but it is also compatible with finer powders, making it suitable for both print and dispense applications. Additionally, WS488 solder paste is readily available in SAC305 and Sn63/Pb37 alloys, with the possibility of other alloys upon request.