NC217 Gel Flux

NC217 No Clean Gel Flux is specifically formulated for rework of all types of surface mount components. Its gel-like consistency is engineered for easy touch-up and precise flux application.

Dried, NC217 flux residues pass IPC J-STD-004* SIR without additional heat and are tack-free in 2-4 hours. The powerful activator system of NC217 promotes wetting and shiny joints even on difficult to solder surfaces.

NC217 is compatible with AIM’s entire line of no clean solder paste, cored solder wire, and flux formulations, meeting IPC-610 flux requirements.

Formulated for Rework and Repair
Ideal for BGAs: Wide Process Window
Electrically Safe Unheated
ROL0
Controlled Application
Easy to Clean Residue
Passes SIR in Raw State

Ideal for BGA rework/reballing and QFN/LGA repair
Residues can be left on the board after soldering
• When cleaning is required, residues can be removed using common flux removers
Wide process window offers increased manufacturing flexibility
Residues pass SIR without adding heat
• Ideal for automotive, medical, and aerospace applications
Tin-Lead and lead-free compatible
Improved heat transfer results in reduced cycle time
Designed for use with soldering irons, hot air pencils, BGA rework stations, micro-ovens, and hot air units

Flux Type	Applications	Application Method	Alloy Compatibility
ROL0	BGA Sphere Attach Rework Component Removal	Dispense Print Dip	Pb and PB-Free

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For TDS (Technical Data Sheet) & SDS (Safety Data Sheet) send email on support@pai-aimsolder.com