Sn42/Bi57/Ag1 is a low melting temperature alloy with improved wetting and fatigue characteristics versus Sn42/Bi58. It is composed of 42% tin, 57% bismuth and 1% silver.

Low temperature solders require a lower peak reflow temperature than other lead-free solder alloys, reducing energy consumption and component-warpage related defects such as NWO (non-wet opens).

Sn42/Bi57/Ag1 is available with specially formulated fluxes to ensure electrochemical reliability even with reduced soldering temperatures.