SAC305 | Persang-alloy

SAC305 Lead-Free Solder Alloy

SAC305 Electropure is a high purity lead-free alloy containing 96.5% tin, 3% silver, and 0.5% copper. In solid solders, PAI-AIM’s Electropure proprietary manufacturing method reduces suspended oxides creating a low drossing, strong wetting alloy.

SAC305 is widely used in hand, selective, wave and SMT soldering. SAC305 provides durable joint strength and the lowest melting point of tin/silver/copper solders.

SAC305 alloy is available in solder wire, solder bar, and solder paste.

Cost Effective Sn/Ag/Cu Alloy
Excellent Solder Joint Reliability
Best Wetting Sn/Ag/Cu Alloy
Manufactured with AIM Electropure™ Technology
Global Standard Lead-Free Alloy
Complies with IPC, JEDEC, RoHS, and REACH Pb-free soldering standards

PAI-AIM’s Electropure technology reduces solder drossing, improves flow and reduces bridging
IPC/JEIDA/IEC/EIN recommended alloy for lead-free soldering
Suitable for a wide variety of applications
SAC305 melting point: 217-220°C
Popular in consumer and automotive applications

Composition	Melting Temperature (℃)	Peak Reflow Temperature Range (℃)	Cost Level
Sn/Ag/Cu	217°C – 220°C	240°C – 250°C	$$

If the document you need is not listed below, please contact your local PAI-AIM Customer Service Rep or contact us to request the document.

SAC305 TDS – English
For SDS (Safety Data Sheets) send email on support@pai-aimsolder.com