PAI-AIM’s RMA258-15R Rosin-Based Solder Paste is specifically formulated to cater to the military, space, and aerospace markets. This solder paste efficiently combines the demands of high-reliability performance, meeting legacy specifications, with the capabilities of modern solder pastes.

RMA258-15R ensures stable print definitions and boasts long pause-to-print capabilities. It effectively minimizes voiding, HiP, and NWO defects, enhancing the overall reliability of soldered joints. The superior wetting characteristics of RMA258-15R are observed with both leaded and lead-free alloys, resulting in bright, smooth, and shiny solder joints.

This solder paste excels in exceptional reflow performance, even during long, hot profiles. After reflow, it leaves amber-colored post-reflow residues, which are specifically designed for removal in saponified batch, in-line, or solvent wash processes.