W20 Solder Paste

PAI-AIM’s W20 Water Soluble Solder Paste has been developed to meet the industry’s demand for a consistently reliable zero-halogen water soluble solder paste. W20 offers enhanced wetting performance in an innovative halogen-free flux chemistry. W20 exhibits excellent print performance with an 8+ hour stencil life while reducing voids on challenging SMT components. This all-purpose water soluble solder paste leaves post-reflow residues that are easily removed with plain or DI water, even under low stand-off devices. W20 is formulated for use with SAC305 T4 powder and is a RoHS compliant solder paste. W20 solder paste can be combined with WS716 liquid flux and WS482 solder wire for a zero-halogen water soluble solution.

*lead-free alloys

Zero halide & halogen per current Rev J-STD-004
8+ hour stencil life
Low voiding on QFN and BGA’s
Easy to clean residues using DI water
Extended cleaning window of 2+ weeks
Low foaming formulation
Wide reflow process window
Available in SAC305
RoHS Compliant*

For use in SMT applications where PCB washing is required. W20 residues are easily cleaned using DI water, even under low standoff components
Provides stable print performance for the most demanding electronic assemblies
Reduces overall voiding without nitrogen
Post reflow residues can be cleaned easily after waiting 2 weeks after initial reflow

Alloys	Melting Temperatures (℃)	Peak Reflow Temperature Range (℃)	Alloy Attributes
SAC305	217°C -220°C	230°C-260°C	Excellent wetting characteristics Compatible with all flux types

If the document you need is not listed below, please contact your local PAI-AIM Customer Service Rep or contact us to request the document.

W20 TDS – English
For SDS (Safety Data Sheets) send email on support@pai-aimsolder.com