NC258 Solder Paste

PAI-AIM’s NC258 Solder Paste delivers next-level performance for advanced SMT applications, especially when used with T3, T4, and finer mesh alloy powders. Engineered for today’s Electronics devices. Its advanced activator system minimizes wetting-related defects such as head-in-pillow (HiP) and produces smooth, shiny solder joints.

NC258 Sn63/Pb37 is also proven to reduce BGA and bottom termination component (BTC) voiding to as low as <5% and <10% respectively. Additionally, it meets stringent automotive and high-reliability standards, passing all solder paste’s criteria.

Optimized for T3, T4, and finer mesh alloy powders in modern electronics manufacturing
Advanced activator system minimizes head-in-pillow (HiP) defects and delivers smooth, shiny solder joints
Achieves <5% voiding in BGAs and <10% in bottom termination components (BTCs)
Meets stringent automotive and high-reliability industry standards
Sn63/Pb37 eutectic alloy with no-clean formulation for efficient processing

Provides stable print performance for the most demanding, high density electronic assemblies
Solves issues related to ultra-fine pitch printing, NWO defects, and voiding on a variety of LED, QFN, LGA and µmBGA components
Accommodates a wide range of profiling processes and techniques
Reduces DPMO (Defects Per Million Opportunities)
Residues are clear and pin-testable that pass stringent automotive and military high reliability SIR testing requirements
Available for printing and dispensing solder paste applications

Alloys	Melting Temperatures (℃)	Peak Reflow Temperature Range (℃)	Alloy Attributes
SAC305	217°C -220°C	230°C-260°C	Excellent wetting characteristics Compatible with all flux types
REL61	208°C -215°C	230°C-250°C	Enhanced reliability vs low/no-silver alloys Low-cost alternative to SAC alloys Improved wetting vs low/no-silver alloys
REL22	210°C -219°C	230°C-250°C	Enhanced/ High reliability for use in extremely harsh environments Improved thermal cycling performance Improved wetting vs low/no-silver alloys
SN100C	227°C	240°C-260°C	Low-cost alternative to SAC alloys Silver-Free Bright shiny solder joints
Sn63/Pb37	183°C	205°C-235°C	Legacy alloy for electronics soldering Mil-spec approved Product contains Pb (leaded alloy)

If the document you need is not listed below, please contact your local PAI-AIM Customer Service Rep or contact us to request the document.

NC258 TDS – English
For SDS (Safety Data Sheets) send email on support@pai-aimsolder.com